This presentation is re-scheduled from an earlier date.
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11:50 AM – 12:00 PM: Check-in
12:00 PM: Presentation & QA
WE USUALLY GET PRESENTER SLIDE DECK, but sometimes not. When speaker provides it, in original or sanitized form, it will be uploaded at the chapter website – www.ieee.org/scveps. Older presentation may also be accessed at same page.
Summary:
New requirements for communication (e.g., 5G) and radar (e.g., automotive) applications at millimeter-wave frequencies have fostered the development of new packaging solutions for circuit and subsystem manufacturing. In the area of RF compound semiconductors, technologies for the co-integration of high-performance devices and silicon circuits have also emerged.
HRL is developing a technology called MECAMIC (Metal Embedded Chiplet Assembly for Microwave Integrated Circuits) that uses GaN transistor chiplets integrated in the volume of passive interposer wafers. Engineering advances in chiplet manufacturing and assembly will be presented, along with a Process Design Kit and circuit demonstrators up to W-band.